MICROETCHING AGENT FOR COPPER, REPLENISHMENT SOLUTION THEREOF, AND METHOD FOR PRODUCING WIRING BOARD
- Application ID: EP13762721
- Status: █ EXAMINATION IN PROGRESS
This patent has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in the combination C23 and H05. We found, that Berendt Leyh & Hering, Koepe & Partner Patentanwälte, Cremer & Cremer, Gille Habral, Reichert & Kollegen and 8 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.