METHOD FOR IMPROVING THE ADHESION OF PLATED METAL LAYERS TO SILICON
- Application ID: EP13753849
- Status: █ EXAMINATION IN PROGRESS
This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Bird Goën & Co NV, DenK iP bvba, and Office Kirkpatrick S.A. are specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.
- 17.09.2012 - Priority Date (US 201261701843P)
- 20.03.2014 - Publication A2 (WO2014040834)
- 22.07.2015 - Publication A2 (EP2896070)