Priority Date: 14.02.12 (JP 20120029646)

SOLDER JOINT STRUCTURE, POWER MODULE, HEAT-SINK-ATTACHED SUBSTRATE FOR POWER MODULE, METHOD FOR PRODUCING SAID SUBSTRATE, AND PASTE FOR FORMING SOLDER UNDERLAYER

  • Application ID: EP13748657
  • Status: GRANT OF PATENT INTENDED

Applicant

Attorney

Employment test 51 - 200 employees
Company dna hoffmann eitle
operating since 1892
Headquarter in Munich and 4 offices
active in Legal Services and IP Portfolio Processing

Specialization

This patent has the IPC combination B23 (MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination B23 and H01. We found, that Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, Kaufmann Patent- und Rechtsanwälte, Patentanwaltskanzlei Dr. Steiniger, Patentbüro Paul Rosenich AG, Ammann Patentanwälte AG and 31 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 14.02.2012 - Priority Date (JP 20120029646)
  • 22.08.2013 - Publication A1 (WO2013122126)
  • 24.12.2014 - Publication A1 (EP2816593)

IPC Classification