Priority Date: 01.02.12 (JP 20120020171)

SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES, AND PASTE FOR BONDING COPPER MEMBER

  • Application ID: EP13742826
  • Status: GRANT OF PATENT INTENDED

Applicant

Attorney

Employment test 51 - 200 employees
Company dna hoffmann eitle
operating since 1892
Headquarter in Munich and 6 offices
active in Legal Services and IP Portfolio Processing

Specialization

This EP application has the IPC class B23, C22, and H01. We found, that Beetz & Partner, Heraeus Holding GmbH, Plansee Group Service GmbH, Patentanwaltskanzlei Jell are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 01.02.2012 - Priority Date (JP 20120020171)
  • 08.08.2013 - Publication A1 (WO2013115359)
  • 10.12.2014 - Publication A1 (EP2811513)