Priority Date: 01.02.12 (JP 20120020171)

SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES, AND PASTE FOR BONDING COPPER MEMBER

  • Application ID: EP13742826
  • Status: GRANT OF PATENT INTENDED

Applicant

Attorney

Employment test 51 - 200 employees
Company dna hoffmann eitle
operating since 1892
Headquarter in Munich and 4 offices
active in Legal Services and IP Portfolio Processing

Specialization

This patent has the IPC combination B23, C22, and H01 is specialized in the combination B23, C22, and H01. We found, that Beetz & Partner is specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 01.02.2012 - Priority Date (JP 20120020171)
  • 08.08.2013 - Publication A1 (WO2013115359)
  • 10.12.2014 - Publication A1 (EP2811513)