Priority Date: 09.07.12 (US 201261669611P)

INTEGRATING THROUGH SUBSTRATE VIAS FROM WAFER BACKSIDE LAYERS OF INTEGRATED CIRCUITS

  • Application ID: EP13739904
  • Status: EXAMINATION REQUESTED

Applicant

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Technology Company

Attorney

operating since 1907
Headquarter in London and 2 offices
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 09.07.2012 - Priority Date (US 201261669611P)
  • 16.01.2014 - Publication A1 (WO2014011615)
  • 13.05.2015 - Publication A1 (EP2870628)

IPC Classification