Priority Date: 06.01.12 (JP 20120001177)

COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, METHOD FOR MANUFACTURING COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, AND CONDUCTIVE PART AND TERMINAL FOR ELECTRONIC/ELECTRIC DEVICE

  • Application ID: EP13733581
  • Status: EXAMINATION IN PROGRESS

Applicants

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Technology Company

Attorney

Employment test 51 - 200 employees
Company dna hoffmann eitle
operating since 1892
Headquarter in Munich and 4 offices
active in Legal Services and IP Portfolio Processing

Specialization

This patent has the IPC combination C22 (METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS) and H01 (BASIC ELECTRIC ELEMENTS) Hoffmann Eitle PartmbB is specialized in the combination C22 and H01. We found, that Patentanwälte Rauschenbach, Grünecker Patent- und Rechtsanwälte PartG mbB, Banse & Steglich, Beetz & Partner, Boeters & Lieck and 7 others are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.

Timeline

  • 06.01.2012 - Priority Date (JP 20120001177)
  • 11.07.2013 - Publication A1 (WO2013103149)
  • 12.11.2014 - Publication A1 (EP2801630)