Priority Date: 16.03.12 (US 201261611627P)

METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS

  • Application ID: EP13729416
  • Status: GRANT OF PATENT INTENDED

Attorneys

Employment test 51 - 200 employees
Company dna vossius and partner
operating since 1961
Headquarter in Munich and 3 offices
active in Legal Services and IP-related Communication Service
Employment test 51 - 200 employees
Company dna prinz and partner
operating since 1928
Headquarter in Munich and 2 offices
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 16.03.2012 - Priority Date (US 201261611627P)
  • 19.09.2013 - Publication A1 (WO2013136188)
  • 21.01.2015 - Publication A1 (EP2826065)

IPC Classification