Priority Date: 31.01.12 (FR 20120000285)

METHOD FOR ASSEMBLING AN ELEMENT HAVING A MICROELECTRONIC CHIP ONTO A WIRE ELEMENT, AND EQUIPMENT FOR CARRYING OUT THE ASSEMBLY

  • Application ID: EP13712302
  • Status: PATENT GRANTED

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Specialization

This EP application has the IPC combination B23, G06, and H01. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 31.01.2012 - Priority Date (FR 20120000285)
  • 08.08.2013 - Publication A1 (WO2013114009)
  • 10.12.2014 - Publication A1 (EP2810299)
  • 20.07.2016 - Publication B1 (EP2810299)