Priority Date: 31.01.12 (FR 20120000285)

METHOD FOR ASSEMBLING AN ELEMENT HAVING A MICROELECTRONIC CHIP ONTO A WIRE ELEMENT, AND EQUIPMENT FOR CARRYING OUT THE ASSEMBLY

  • Application ID: EP13712302
  • Status: PATENT GRANTED

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Specialization

This patent has the IPC combination B23, G06, and H01 is specialized in the combination B23, G06, and H01. We found, that Reichert & Kollegen, Novagraaf International S.A. are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 31.01.2012 - Priority Date (FR 20120000285)
  • 08.08.2013 - Publication A1 (WO2013114009)
  • 10.12.2014 - Publication A1 (EP2810299)
  • 20.07.2016 - Publication B1 (EP2810299)