METHOD FOR ASSEMBLING AN ELEMENT HAVING A MICROELECTRONIC CHIP ONTO A WIRE ELEMENT, AND EQUIPMENT FOR CARRYING OUT THE ASSEMBLY
- Application ID: EP13712302
- Status: █ PATENT GRANTED
This patent has the IPC combination B23, G06, and H01 is specialized in the combination B23, G06, and H01. We found, that Reichert & Kollegen, IP Sextant s.r.l., Novagraaf International S.A. are specialized in all of these IPC classes. For a similar patent, they might be a good choice.