Priority Date: 24.08.12 (US 201261693032P)

APPARATUS FOR CYLINDRICAL MAGNETRON SPUTTERING

  • Application ID: EP13710953
  • Status: GRANT OF PATENT INTENDED

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Specialization

This patent has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination C23 and H01. We found, that Patentanwälte Rauschenbach, Patentanwaltskanzlei Dr. Steiniger, Bird Goën & Co NV, Troesch Scheidegger Werner AG, adares Reininger & Partner and 23 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 24.08.2012 - Priority Date (US 201261693032P)
  • 27.02.2014 - Publication A1 (WO2014031156)
  • 01.07.2015 - Publication A1 (EP2888755)

IPC Classification