Priority Date: 29.03.12 (EP 20120075036)

METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS

  • Application ID: EP13710864
  • Status: NO OPPOSITION FILED WITHIN TIMELIMIT

Applicant

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Technology Company

Attorney

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Specialization

This patent has the IPC class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) is specialized in C23. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 29.03.2012 - Priority Date (EP 20120075036)
  • 03.10.2013 - Publication A1 (WO2013143961)
  • 14.01.2015 - Publication A1 (EP2823084)
  • 19.08.2015 - Publication B1 (EP2823084)

IPC Classification