Priority Date: 24.02.12 (US 201213405125)

METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

  • Application ID: EP13710116
  • Status: GRANT OF PATENT INTENDED

Applicant

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Technology Company

Attorney

Employment test 51 - 200 employees
Company dna maiwald patentanwalts gmbh
operating since 1995
Headquarter in Munich and 4 offices
active in Legal Services and IP Consulting

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 24.02.2012 - Priority Date (US 201213405125)
  • 29.08.2013 - Publication A1 (WO2013126269)
  • 31.12.2014 - Publication A1 (EP2817823)