Priority Date: 10.02.12 (US 201261597366P)

MOLDED LENS FORMING A CHIP SCALE LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

  • Application ID: EP13710014
  • Status: GRANT OF PATENT INTENDED

Applicant

Technology company logo small
Technology Company

Attorneys

no operation time available
2 offices
Technology Company
no operation time available
5 offices
Technology Company
no operation time available
5 offices
Technology Company

Specialization

This EP application has the IPC combination B29 (WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Riechelmann & Carlsohn GbR, Ilberg & Weißfloh, Patentanwaltskanzlei Dr. Steiniger, Sarap & Putk Patent Agency and 28 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 10.02.2012 - Priority Date (US 201261597366P)
  • 15.08.2013 - Publication A1 (WO2013118002)
  • 17.12.2014 - Publication A1 (EP2812929)