Priority Date: 02.03.12 (US 201213411275)

SEMICONDUCTOR LASER CHIP PACKAGE WITH ENCAPSULATED RECESS MOLDED ON SUBSTRATE AND METHOD FOR FORMING SAME

  • Application ID: EP13709016
  • Status: GRANT OF PATENT INTENDED

Attorney

operating since 2009
Headquarter in Lyngby and 1 office
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 02.03.2012 - Priority Date (US 201213411275)
  • 06.09.2013 - Publication A2 (WO2013130580)
  • 07.01.2015 - Publication A2 (EP2820726)

IPC Classification