Priority Date: 20.12.12 (CZ 20120000940)

Method of creating interlayer on glass testing substrate intended for sticking chips, and applying device for carrying out of the method

  • Application ID: EP13466038
  • Status: PATENT GRANTED

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Specialization

This EP application has the IPC class C03 (GLASS; MINERAL OR SLAG WOOL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Ter Meer Steinmeister & Partner PartGmbB, Blumbach Zinngrebe Patent-und Rechtsanwälte GbR patentConsult, Adolf Lüken Höflich Sawodny, Fuchs Patentanwälte Partnerschaft mbB, Müller-Boré & Partner Patentanwälte PartG mbB and 10 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 20.12.2012 - Priority Date (CZ 20120000940)
  • 25.06.2014 - Publication A2 (EP2746235)
  • 16.03.2016 - Publication A3 (EP2746235)
  • 17.05.2017 - Publication B1 (EP2746235)