Priority Date: 20.12.12 (CZ 20120000940)

Method of creating interlayer on glass testing substrate intended for sticking chips, and applying device for carrying out of the method

  • Application ID: EP13466038


no operation time available
1 office
active in Legal Services


This patent has the IPC combination C03 (GLASS; MINERAL OR SLAG WOOL) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination C03 and H01. We found, that Ilberg & Weißfloh, Gulde & Partner Patent- und Rechtsanwaltskanzlei mbB, Ter Meer Steinmeister & Partner PartGmbB, Blumbach Zinngrebe Patent-und Rechtsanwälte GbR patentConsult, Adolf Lüken Höflich Sawodny and 8 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.


  • 20.12.2012 - Priority Date (CZ 20120000940)
  • 25.06.2014 - Publication A2 (EP2746235)
  • 16.03.2016 - Publication A3 (EP2746235)
  • 17.05.2017 - Publication B1 (EP2746235)