Semiconductor device with through-substrate via and method of producing a semiconductor device with through-substrate via
- Application ID: EP13199683
- Status: █ GRANT OF PATENT INTENDED
This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Epping Hermann Fischer Patentanwaltsgesellschaft mbH is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.