Die with a multilayer backside interface layer for solder bonding to a substrate and corresponding manufacturing method

  • Application ID: EP13199587
  • Status: GRANT OF PATENT INTENDED

Applicants

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Technology Company
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Technology Company
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Technology Company

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Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 01.07.2015 - Publication A1 (EP2889903)

IPC Classification