Die with a multilayer backside interface layer for solder bonding to a substrate and corresponding manufacturing method
- Application ID: EP13199587
- Status: █ GRANT OF PATENT INTENDED
This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). NXP B.V. is specialized in H01. NXP B.V., Arnold & Siedsma is specialised in H01 (BASIC ELECTRIC ELEMENTS). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.