Silver wire bonding on printed circuit boards and IC-substrates

  • Application ID: EP13198900
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

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Technology Company

Attorney

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Specialization

This patent has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in the combination H01 and H05. We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, Grünecker Patent- und Rechtsanwälte PartG mbB, Novagraaf, Santarelli and 41 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 24.06.2015 - Publication A1 (EP2887779)

IPC Classification