Silver wire bonding on printed circuit boards and IC-substrates

  • Application ID: EP13198900
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

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Attorney

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Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, Grünecker Patent- und Rechtsanwälte PartG mbB, Novagraaf, Santarelli and 46 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 24.06.2015 - Publication A1 (EP2887779)

IPC Classification