Silver wire bonding on printed circuit boards and IC-substrates
- Application ID: EP13198900
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). Atotech Deutschland GmbH is specialized in the combination H01 and H05. We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, Awapatent AB, Grünecker Patent- und Rechtsanwälte PartG mbB, Novagraaf and 43 others are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.