Silver wire bonding on printed circuit boards and IC-substrates
- Application ID: EP13198900
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). Atotech Deutschland GmbH is specialized in the combination H01 and H05. We found, that Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, AWA, Grünecker Patent- und Rechtsanwälte PartG mbB, advotec., M. Zardi & CO SA and 42 others are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.