Priority Date: 06.11.13 (US 201314073040)

Electroplated silver alloy bump for a semiconductor structure

  • Application ID: EP13194235
  • Status: █ APPLICATION DEEMED TO BE WITHDRAWN

Attorney

Employment test 1 - 10 employees
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Company dna patentanwalte blasberg kewitz and reichel
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2K Patentanwälte Blasberg K...
Headquarter in Frankfurt am Main
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Specialization

This patent has the IPC combination C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination C25 and H01. We found, that Coller IP Management Ltd, Yeadon IP Ltd, IXAS Conseil are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 06.11.2013 - Priority Date (US 201314073040)
  • 03.06.2015 - Publication A2 (EP2879173)
  • 26.08.2015 - Publication A3 (EP2879173)