Priority Date: 06.11.13 (US 201314073040)

Electroplated silver alloy bump for a semiconductor structure

  • Application ID: EP13194235
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Attorney

Employment test 1 - 10 employees
Company dna patentanwalte blasberg kewitz and reichel
no operation time available
Headquarter in Frankfurt am Main
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC class C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Hansen und Heeschen, Atotech Deutschland GmbH, Yeadon IP Ltd, Haldor Topso̸e A/S and 2 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 06.11.2013 - Priority Date (US 201314073040)
  • 03.06.2015 - Publication A2 (EP2879173)
  • 26.08.2015 - Publication A3 (EP2879173)