Priority Date: 06.11.13 (US 201314073040)
Electroplated silver alloy bump for a semiconductor structure
- Application ID: EP13194235
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
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Specialization
This EP application has the IPC class C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Hansen und Heeschen, Atotech Deutschland GmbH, Yeadon IP Ltd, Haldor Topso̸e A/S and 2 others are specialized in this combination either. For a similar patent, they might be a good choice.
Timeline
- 06.11.2013 - Priority Date (US 201314073040)
- 03.06.2015 - Publication A2 (EP2879173)
- 26.08.2015 - Publication A3 (EP2879173)