Priority Date: 12.11.13 (US 201314078240)

Method of manufacturing a silver alloy bump for a semiconductor structure using a cyanide-based plating bath

  • Application ID: EP13194234
  • Status: EXAMINATION IN PROGRESS

Attorney

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Company dna patentanwalte blasberg kewitz and reichel
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Headquarter in Frankfurt am Main
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Specialization

This EP application has the IPC combination C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Patentanwälte Rauschenbach, Hansen und Heeschen, Atotech Deutschland GmbH, Yeadon IP Ltd and 3 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 12.11.2013 - Priority Date (US 201314078240)
  • 03.06.2015 - Publication A2 (EP2879169)
  • 26.08.2015 - Publication A3 (EP2879169)