Method of manufacturing a silver alloy bump for a semiconductor structure using a cyanide-based plating bath
- Application ID: EP13194234
- Status: █ EXAMINATION IN PROGRESS
This EP application has the IPC class C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Coller IP Management Ltd, Yeadon IP Ltd, IXAS Conseil are specialized in this combination either. For a similar patent, they might be a good choice.