Priority Date: 19.10.12 (EP 20120007249)

Embedded chip packages and methods for manufacturing an embedded chip package

  • Application ID: EP13189068
  • Status: EXAMINATION REQUESTED

Applicant

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Technology Company

Attorney

Employment test 51 - 200 employees
Company dna viering jentschura and partner
operating since 1976
Headquarter in Munich and 5 offices
active in Legal Services, IP Consulting, and IP-related Communication Service

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 19.10.2012 - Priority Date (EP 20120007249)
  • 23.04.2014 - Publication A2 (EP2722876)
  • 27.04.2016 - Publication A3 (EP2722876)

IPC Classification