Method for producing a thin solder layer
- Application ID: EP13187760
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
Attorneysno data provided
This patent has the IPC combination B23 (MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR) and C09 (DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR) is specialized in the combination B23 and C09. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.