Method for producing a thin solder layer
- Application ID: EP13187760
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
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This EP application has the IPC combination B23 (MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR) and C09 (DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR). There is no patent agent firm in the market, which is specialized in this combination of IPC classes.