Providing a chip die with electrically conductive elements

  • Application ID: EP13175623
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

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Specialization

This EP application has the IPC combination B23, C23, and H01. We found, that Hansen und Heeschen, Element Six Ltd, Chemetall GmbH, Plansee Group Service GmbH, Patentanwaltskanzlei Jell and 1 other are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 14.01.2015 - Publication A1 (EP2824699)