Providing a chip die with electrically conductive elements
- Application ID: EP13175623
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This patent has the IPC combination B23, C23, and H01 is specialized in the combination B23, C23, and H01. We found, that Patentanwaltskanzlei Dr. Steiniger, Reichert & Kollegen, WIRNSBERGER & LERCHBAUM Patentanwälte OG, Patentanwaltskanzlei Kai Kohlmann are specialized in all of these IPC classes. For a similar patent, they might be a good choice.