Providing a chip die with electrically conductive elements
- Application ID: EP13175623
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC combination B23, C23, and H01. We found, that Meissner Bolte & Partnerschaft mbB, Berendt Leyh & Hering, Gille Hrabal, Patentanwälte Kindermann GbR, Heraeus Holding GmbH and 3 others are specialized in this combination either. For a similar patent, they might be a good choice.