Providing a chip die with electrically conductive elements
- Application ID: EP13175623
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC class B23, C23, and H01. We found, that Hansen und Heeschen, Chemetall GmbH, Plansee Group Service GmbH, Patentanwaltskanzlei Jell, Patentanwaltskanzlei Kai Kohlmann are specialized in this combination either. For a similar patent, they might be a good choice.