Providing a chip die with electrically conductive elements
- Application ID: EP13175623
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC combination B23, C23, and H01. We found, that Hansen und Heeschen, Element Six Ltd, Chemetall GmbH, Plansee Group Service GmbH, Patentanwaltskanzlei Jell and 1 other are specialized in this combination either. For a similar patent, they might be a good choice.