Priority Date: 06.01.07 (US 20070879177P)

Wireless headset comprising a housing and an earbud electrically coupled to the housing by a flexible circuit board

  • Application ID: EP13171970
  • Status: NO OPPOSITION FILED WITHIN TIMELIMIT

Applicant

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Specialization

This EP application has the IPC combination H04 (ELECTRIC COMMUNICATION TECHNIQUE) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that AWA, Dreiss Patentanwälte PartG mbB, Schumacher & Willsau Patentanwaltsgesellschaft mbH, Becker Kurig Straus, Kahler Käck Mollekopf and 12 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 06.01.2007 - Priority Date (US 20070879177P)
  • 18.09.2013 - Publication A1 (EP2640170)
  • 29.07.2015 - Publication B1 (EP2640170)