Wireless headset comprising a housing and an earbud electrically coupled to the housing by a flexible circuit board
- Application ID: EP13171970
- Status: █ NO OPPOSITION FILED WITHIN TIMELIMIT
This EP application has the IPC combination H04 (ELECTRIC COMMUNICATION TECHNIQUE) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that AWA, Dreiss Patentanwälte PartG mbB, Schumacher & Willsau Patentanwaltsgesellschaft mbH, Becker Kurig Straus, Kahler Käck Mollekopf and 12 others are specialized in this combination either. For a similar patent, they might be a good choice.