Integrated sensor chip package with directional light sensor, apparatus including such a package and method of manufacturing such an integrated sensor chip package
- Application ID: EP13171297
- Status: █ EXAMINATION REQUESTED
This patent has the IPC combination G01 (MEASURING; TESTING) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination G01 and H01. We found, that Coller IP Management Ltd, TransMIT GmbH, Müller Hoffmann & Partner, Patentanwälte Rauschenbach, Patentanwaltskanzlei Dr. Steiniger and 120 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.