Integrated sensor chip package with directional light sensor, apparatus including such a package and method of manufacturing such an integrated sensor chip package

  • Application ID: EP13171297
  • Status: EXAMINATION REQUESTED

Applicant

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Specialization

This patent has the IPC combination G01 (MEASURING; TESTING) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination G01 and H01. We found, that Coller IP Management Ltd, TransMIT GmbH, Kailuweit & Uhlemann, Müller Hoffmann & Partner, Patentanwälte Rauschenbach and 115 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 17.12.2014 - Publication A1 (EP2814064)

IPC Classification