Electroless copper plating solution

  • Application ID: EP13161330
  • Status: NO OPPOSITION FILED WITHIN TIMELIMIT

Applicant

Technology company logo small
Technology Company

Attorneys

operating since 1927
Headquarter in Munich
active in Legal Services
operating since 1996
Headquarter in Berlin
active in Legal Services

Specialization

This patent has the IPC class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) is specialized in C23. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 01.10.2014 - Publication A1 (EP2784181)
  • 09.12.2015 - Publication B1 (EP2784181)

IPC Classification