Method for activating a copper surface for electroless plating

  • Application ID: EP13160785
  • Status: NO OPPOSITION FILED WITHIN TIMELIMIT

Applicant

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Specialization

This patent has the IPC combination C23, H01, and H05 is specialized in the combination C23, H01, and H05. We found, that Koepe & Partner Patentanwälte, Cremer & Cremer, Gille Habral, Reichert & Kollegen, Yeadon IP Ltd and 4 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 01.10.2014 - Publication A1 (EP2784180)
  • 30.12.2015 - Publication B1 (EP2784180)

IPC Classification