Method for activating a copper surface for electroless plating
- Application ID: EP13160785
- Status: █ NO OPPOSITION FILED WITHIN TIMELIMIT
This EP application has the IPC combination C23, H01, and H05. Atotech Deutschland GmbH is specialized in the combination C23, H01, and H05. We found, that Riechelmann & Carlsohn GbR, Koepe & Partner Patentanwälte, Cremer & Cremer, Yeadon IP Ltd, Chemetall GmbH and 1 other are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.