Method for activating a copper surface for electroless plating
- Application ID: EP13160785
- Status: █ NO OPPOSITION FILED WITHIN TIMELIMIT
This EP application has the IPC combination C23, H01, and H05. Atotech Deutschland GmbH is specialized in the combination C23, H01, and H05. We found, that Yeadon IP Ltd, Heraeus Holding GmbH, Chemetall GmbH, Pilkington Group Ltd, Patentanwaltskanzlei Kai Kohlmann are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.