Method for activating a copper surface for electroless plating
- Application ID: EP13160785
- Status: █ NO OPPOSITION FILED WITHIN TIMELIMIT
This patent has the IPC combination C23, H01, and H05 is specialized in the combination C23, H01, and H05. We found, that Koepe & Partner Patentanwälte, Cremer & Cremer, Gille Habral, Reichert & Kollegen, Yeadon IP Ltd and 4 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.