Method for depositing a first metallic layer onto non-conductive polymers
- Application ID: EP13155083
- Status: █ EXAMINATION REQUESTED
This patent has the IPC class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) is specialized in C23. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.