Method and apparatus for depositing atomic layers on a substrate

  • Application ID: EP13154339
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

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Specialization

This EP application has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Patentanwälte Rauschenbach, Troesch Scheidegger Werner AG, Kanzlei Kempkens, Berendt Leyh & Hering and 25 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 13.08.2014 - Publication A1 (EP2765218)