Method for depositing thick copper layers onto sintered materials
- Application ID: EP13075031
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This patent has the IPC combination C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in the combination C25 and H05. We found, that Yeadon IP Ltd, Patentanwaltskanzlei Scheffler are specialized in all of these IPC classes. For a similar patent, they might be a good choice.