Method for depositing thick copper layers onto sintered materials
- Application ID: EP13075031
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC combination C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). Atotech Deutschland GmbH is specialized in the combination C25 and H05. We found, that Yeadon IP Ltd, Proi World Intellectual Property GmbH are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.