Method for depositing thick copper layers onto sintered materials
- Application ID: EP13075031
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC class C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Yeadon IP Ltd, ProI European Patent Attorneys, Patentanwaltskanzlei Scheffler are specialized in this combination either. For a similar patent, they might be a good choice.