Method for depositing thick copper layers onto sintered materials

  • Application ID: EP13075031
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

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Attorney

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Specialization

This EP application has the IPC class C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Yeadon IP Ltd, ProI European Patent Attorneys, Patentanwaltskanzlei Scheffler are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 19.11.2014 - Publication A1 (EP2803756)

IPC Classification