COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND BONDING METHOD

  • Application ID: EP12872625
  • Status: GRANT OF PATENT INTENDED

Applicant

Attorney

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Specialization

This patent has the IPC combination B22, B23, H01, and H05 Iridium IP is specialized in the combination B22, B23, H01, and H05. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 03.10.2013 - Publication A1 (WO2013145258)
  • 04.02.2015 - Publication A1 (EP2832472)