COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND BONDING METHOD

  • Application ID: EP12872625
  • Status: GRANT OF PATENT INTENDED

Applicant

Attorney

no operation time available
500.48
Headquarter in Mannheim and 2 offices
active in Legal Services, IP Consulting, IP Portfolio Processing, and IPR-related Financial Service

Specialization

This EP application has the IPC class B22, B23, H01, and H05. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 03.10.2013 - Publication A1 (WO2013145258)
  • 04.02.2015 - Publication A1 (EP2832472)