COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND BONDING METHOD

  • Application ID: EP12872625
  • Status: GRANT OF PATENT INTENDED

Applicant

Attorney

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Specialization

This EP application has the IPC combination B22, B23, H01, and H05. We found, that Heraeus Holding GmbH, Chemetall GmbH are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 03.10.2013 - Publication A1 (WO2013145258)
  • 04.02.2015 - Publication A1 (EP2832472)