Priority Date: 13.03.12 (JP 20120055520)

ETCHING SOLUTION COMPOSITION AND ETCHING METHOD

  • Application ID: EP12871234
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

Technology company logo small
Technology Company

Attorney

Employment test 11 - 50 employees
Company dna kador and partner
operating since 1974
1173.43
Headquarter in Munich and 3 offices
active in Legal Services, IP Consulting, and IP-related Communication Service

Specialization

This EP application has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Riechelmann & Carlsohn GbR, Patentanwälte Rauschenbach, Bird Goën & Co NV, Troesch Scheidegger Werner AG and 25 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 13.03.2012 - Priority Date (JP 20120055520)
  • 19.09.2013 - Publication A1 (WO2013136624)
  • 21.01.2015 - Publication A1 (EP2827363)

IPC Classification