Priority Date: 27.12.11 (JP 20110284611)

CONDUCTIVE FILM FORMING METHOD, COPPER FINE PARTICLE-DISPERSED LIQUID, AND CIRCUIT BOARD

  • Application ID: EP12862999
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Attorney

Employment test 11 - 50 employees
Company dna hoefer and partner
operating since 1920
Headquarter in Munich, Bielefeld
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This patent has the IPC class H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in H05. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 27.12.2011 - Priority Date (JP 20110284611)
  • 04.07.2013 - Publication A1 (WO2013099345)
  • 08.10.2014 - Publication A1 (EP2787796)

IPC Classification