Priority Date: 12.12.11 (JP 20110271081)

POWER MODULE SUBSTRATE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE, PASTE FOR FORMING FLUX COMPONENT PENETRATION PREVENTION LAYER, AND BONDING METHOD FOR ARTICLE TO BE BONDED

  • Application ID: EP12857715
  • Status: GRANT OF PATENT INTENDED

Applicant

Attorney

Employment test 51 - 200 employees
Company dna hoffmann eitle
operating since 1892
Headquarter in Munich and 4 offices
active in Legal Services and IP Portfolio Processing

Specialization

This patent has the IPC combination B23 (MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination B23 and H01. We found, that Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, Kaufmann Patent- und Rechtsanwälte, Patentanwaltskanzlei Dr. Steiniger, Patentbüro Paul Rosenich AG, Ammann Patentanwälte AG and 33 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 12.12.2011 - Priority Date (JP 20110271081)
  • 20.06.2013 - Publication A1 (WO2013089099)
  • 22.10.2014 - Publication A1 (EP2793258)