RESIN COMPOSITION, RESIN COMPOSITION SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Application ID: EP12853475
- Status: █ GRANT OF PATENT INTENDED
This patent has the IPC combination C08, C09, and H01 is specialized in the combination C08, C09, and H01. We found, that Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB, Stolmár & Partner Patentanwälte PartG mbB, Boeters & Lieck, Fuchs Patentanwälte Partnerschaft mbB and 15 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.