IMAGE CAPTURE ELEMENT CHIP MOUNTING METHOD, ENDOSCOPE ASSEMBLY METHOD, IMAGE CAPTURE MODULE, AND ENDOSCOPE
- Application ID: EP12849196
- Status: █ The patent has been granted
This EP application has the IPC combination A61, G02, and H04. We found, that Wuesthoff & Wuesthoff Patentanwälte PartG mbB, Venner Shipley LLP, Ring & Weisbrodt Patentanwaltsgesellschaft mbH, Merten Patentmanagement, Hentrich Patentanwälte PartG mbB and 1 other are specialized in this combination either. For a similar patent, they might be a good choice.