Priority Date: 07.11.11 (JP 20110243528)

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, METHOD FOR MANUFACTURING STACKED CHIP COMPONENT AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

  • Application ID: EP12847519
  • Status: GRANT OF PATENT INTENDED

Applicant

Technology company logo small
Technology Company

Attorney

Employment test 11 - 50 employees
Company dna muller hoffmann and partner
no operation time available
Headquarter in Munich and 1 office
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Müller Hoffmann & Partner is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 07.11.2011 - Priority Date (JP 20110243528)
  • 16.05.2013 - Publication A1 (WO2013069522)
  • 17.09.2014 - Publication A1 (EP2779219)

IPC Classification