Priority Date: 09.12.11 (US 201113316119)

MEMS CHIP SCALE PACKAGE

  • Application ID: EP12810456
  • Status: GRANT OF PATENT INTENDED

Applicant

Technology company logo small
Technology Company

Attorney

Employment test 11 - 50 employees
Company dna dreiss patentanwalte
operating since 1970
Headquarter in Stuttgart
active in Legal Services and IP Consulting

Specialization

This patent has the IPC combination B81 (MICRO-STRUCTURAL TECHNOLOGY) and H04 (ELECTRIC COMMUNICATION TECHNIQUE) is specialized in the combination B81 and H04. We found, that Boco IP Oy Ab, Brevalex are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 09.12.2011 - Priority Date (US 201113316119)
  • 13.06.2013 - Publication A1 (WO2013086106)
  • 15.10.2014 - Publication A1 (EP2788279)

IPC Classification