MEMS CHIP SCALE PACKAGE
- Application ID: EP12810456
- Status: █ GRANT OF PATENT INTENDED
This patent has the IPC combination B81 (MICRO-STRUCTURAL TECHNOLOGY) and H04 (ELECTRIC COMMUNICATION TECHNIQUE) is specialized in the combination B81 and H04. We found, that Boco IP Oy Ab, Brevalex are specialized in all of these IPC classes. For a similar patent, they might be a good choice.