Priority Date: 21.12.11 (CN 20111463131)

METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

  • Application ID: EP12805956
  • Status: PATENT GRANTED

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Specialization

This patent has the IPC combination C23, C25, H01, and H05 is specialized in the combination C23, C25, H01, and H05. We found, that Yeadon IP Ltd is specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 21.12.2011 - Priority Date (CN 20111463131)
  • 27.06.2013 - Publication A1 (WO2013092131)
  • 29.10.2014 - Publication A1 (EP2796019)
  • 04.01.2017 - Publication B1 (EP2796019)