Priority Date: 11.11.11 (US 201113294831)

METHOD AND APPARATUS FOR WAFER-LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES

  • Application ID: EP12798930
  • Status: GRANT OF PATENT INTENDED

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Specialization

This patent has the IPC class B81 (MICRO-STRUCTURAL TECHNOLOGY) is specialized in B81. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 11.11.2011 - Priority Date (US 201113294831)
  • 16.05.2013 - Publication A1 (WO2013071051)
  • 24.09.2014 - Publication A1 (EP2780278)

IPC Classification