Priority Date: 29.04.11 (US 201161481077P)

THIN FILM SOLDER BOND

  • Application ID: EP12777290
  • Status: EXAMINATION IN PROGRESS

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Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 29.04.2011 - Priority Date (US 201161481077P)
  • 01.11.2012 - Publication A2 (WO2012149514)
  • 05.03.2014 - Publication A2 (EP2702616)

IPC Classification