Priority Date: 09.09.11 (US 201113228925)

SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME

  • Application ID: EP12769214
  • Status: GRANT OF PATENT INTENDED

Applicant

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Technology Company

Attorney

operating since 1907
Headquarter in London and 2 offices
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This patent has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in the combination H01 and H05. We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, Grünecker Patent- und Rechtsanwälte PartG mbB, Novagraaf, Santarelli and 42 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 09.09.2011 - Priority Date (US 201113228925)
  • 14.03.2013 - Publication A1 (WO2013036948)
  • 16.07.2014 - Publication A1 (EP2754169)

IPC Classification