METHOD AND APPARATUS FOR ESTIMATING THE TEMPERATURE OF A SEMICONDUCTOR CHIP
- Application ID: EP12750735
- Status: █ NO OPPOSITION FILED WITHIN TIMELIMIT
This EP application has the IPC combination F03, G01, and H01. We found, that TransMIT GmbH, Dr. Meyer-Dulheuer & Partner, Hansen und Heeschen, Kransell & Wennborg KB, LOVEN Patents & Trademarks Limited and 2 others are specialized in this combination either. For a similar patent, they might be a good choice.