Priority Date: 25.10.11 (JP 20110234085)

Semiconductor device package assembly and method of manufacturing a semiconductor device

  • Application ID: EP12186099
  • Status: PATENT GRANTED

Applicant

Attorney

Employment test 11 - 50 employees
Company dna kohler schmid mobus
operating since 1900
Headquarter in Stuttgart and 1 office
active in Legal Services

Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Kohler Schmid Möbus Patentanwälte Partnerschaftsgesellschaft mbB is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 25.10.2011 - Priority Date (JP 20110234085)
  • 01.05.2013 - Publication A2 (EP2587558)
  • 02.07.2014 - Publication A3 (EP2587558)
  • 02.11.2016 - Publication B1 (EP2587558)

IPC Classification