Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape
- Application ID: EP12159227
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC class C09 (DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR) and H01 (BASIC ELECTRIC ELEMENTS). There is no patent agent firm in the market, which is specialized in this combination of IPC classes.