Pressure-sensitive adhesive tape for resin encapsulation and method for producing resin encapsulation type semiconductor device
- Application ID: EP12158418
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC class C09 (DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Patentanwälte Rauschenbach, Engel Patentanwaltskanzlei, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB, Abrema Agence Brevets & Marques and 31 others are specialized in this combination either. For a similar patent, they might be a good choice.