Pressure-sensitive adhesive tape for resin encapsulation and method for producing resin encapsulation type semiconductor device

  • Application ID: EP12158418
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

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Technology Company

Attorney

Employment test 201 - 500 employees
Company dna grunecker kinkeldey stockmair and schwanhausser
operating since 1924
Headquarter in Munich and 2 offices
active in Legal Services

Specialization

This EP application has the IPC combination C09 (DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Patentanwälte Rauschenbach, Engel Patentanwaltskanzlei, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB, Abrema Agence Brevets & Marques and 30 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 11.09.2013 - Publication A1 (EP2636712)

IPC Classification