Priority Date: 24.12.10 (JP 20100287782)

BONDING METHOD, BONDING STRUCTURE, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT

  • Application ID: EP11851801
  • Status: EXAMINATION REQUESTED

Applicant

Technology company logo small
Technology Company

Attorney

operating since 1962
Headquarter in Munich
active in Legal Services and Matchmaking and Trading

Specialization

This EP application has the IPC class B23, C22, and H05. We found, that Heraeus Holding GmbH is specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 24.12.2010 - Priority Date (JP 20100287782)
  • 28.06.2012 - Publication A1 (WO2012086745)
  • 30.10.2013 - Publication A1 (EP2656955)