Priority Date: 29.11.10 (JP 20100265807)

SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE

  • Application ID: EP11845260
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

Attorney

no operation time available
Headquarter in Munich
active in Legal Services

Specialization

This EP application has the IPC combination C11 (ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Henkel AG & Co. KGaA, Lawrie IP Limited, Dres. Fitzner Rechts- und Patentanwälte are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 29.11.2010 - Priority Date (JP 20100265807)
  • 07.06.2012 - Publication A1 (WO2012073909)
  • 09.10.2013 - Publication A1 (EP2647693)