HEAT TREATMENT METHOD FOR WAFER, METHOD FOR PRODUCING SILICON WAFER, SILICON WAFER, AND HEAT TREATMENT APPARATUS
- Application ID: EP11817884
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC class C30 (CRYSTAL GROWTH) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Bauer Vorberg Kayser mbB, AOMB Polska Sp. z o.o., LifeTech IP, Spies Danner & Partner, Patentanwälte PartG mbB, Neij & Lindberg AB, Siltronic AG are specialized in this combination either. For a similar patent, they might be a good choice.