Priority Date: 02.12.10 (US 20100958638)

SELECTIVE SEED LAYER TREATMENT FOR FEATURE PLATING

  • Application ID: EP11813464
  • Status: GRANT OF PATENT INTENDED

Applicant

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Technology Company

Attorney

operating since 1937
1283.11
10 offices
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Riechelmann & Carlsohn GbR, Koepe & Partner Patentanwälte, Cremer & Cremer, Reichert & Kollegen, Atotech Deutschland GmbH and 5 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 02.12.2010 - Priority Date (US 20100958638)
  • 07.06.2012 - Publication A1 (WO2012075450)
  • 09.10.2013 - Publication A1 (EP2647266)

IPC Classification