Priority Date: 30.07.10 (JP 20100172016)

CURING RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL

  • Application ID: EP11812307
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

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Technology Company

Attorneys

operating since 1974
Headquarter in Munich
active in Legal Services and IP Consulting
operating since 1974
Headquarter in Munich
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC combination C08 (ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Riechelmann & Carlsohn GbR, Patentanwälte Rauschenbach, Boehmert & Boehmert Anwaltspartnerschaft mbB, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB and 29 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 30.07.2010 - Priority Date (JP 20100172016)
  • 02.02.2012 - Publication A1 (WO2012014715)
  • 05.06.2013 - Publication A1 (EP2599812)