Priority Date: 30.07.10 (JP 20100172016)

CURING RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL

  • Application ID: EP11812307
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

Technology company logo small
Technology Company

Attorneys

operating since 1974
Headquarter in Munich
active in Legal Services and IP Consulting
operating since 1974
Headquarter in Munich
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC class C08 (ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON) and H01 (BASIC ELECTRIC ELEMENTS). We found, that TransMIT GmbH, Riechelmann & Carlsohn GbR, Patentanwälte Rauschenbach, Boehmert & Boehmert Anwaltspartnerschaft mbB, Hoffmann Eitle PartmbB and 29 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 30.07.2010 - Priority Date (JP 20100172016)
  • 02.02.2012 - Publication A1 (WO2012014715)
  • 05.06.2013 - Publication A1 (EP2599812)